Liling Xing Tai Long Chemical Ceramic Packing Co., Ltd.
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  • Contact Person : Ms. zhang Julia
  • Company Name : Liling Xing Tai Long Chemical Ceramic Packing Co., Ltd.
  • Tel : 86-0731-23253338
  • Fax : 86-0731-23252938
  • Address : Hunan,ZhuZhou,ShenTan Industrial Zone,Liling,Hunan,China
  • Country/Region : China
  • Zip : 412200

(20 YEARS PROFESSIONAL FOR CERAMIC PLATE SERIALS) Ceramic Alumina Substrate Plate (For HIC & DBC AINWORKABLE!)

(20 YEARS PROFESSIONAL FOR CERAMIC PLATE SERIALS) Ceramic Alumina Substrate Plate (For HIC & DBC AINWORKABLE!)
Product Detailed
Related Categories:Ceramics
Ceramic Alumina Plate 1.With excellent Insulation properties,small dielectric constant 2.High mechanical strength. 3.ISO 9001

The Alumina plate has the features of high reliability,high density power,high thermal conductivity,high insulation and cycling performance.Dimensions can be formed be mould stamping or laser cutting,is used in thick film circuit,large-scale integrated circuit,hybrid IC,semiconductor package,chip resistor and other electronic industry fields.

Item

Test method

Unit

A-75

A-95

A-96

A-99

Density

 

G/cm3

3.20

3.60

3.70

3.70

Air impermeability

 

 

---

pass

pass

pass

Liquid permeation

 

 

pass

pass

pass

pass

Flexural strength

 

Mpa

200

280

280

300

Linear expansion coefficient

20°C--100°C

X10-6/°C

6

---

---

---

20°C--500°C

X10-6/°C

---

6.5—7.5

6.5—7.5

6.5—7.5

20°C--800°C

X10-6/°C

---

6.5—8

6.5—8

6.5—8

Flexural strength

1MHz 20°C

 

9.0

9—10

9—10

9—10.5

500°C

 

---

9—10

9—10

---

10GHz 20°C

 

---

9—10

9—10

9—10.5

Dissipation factor

1MHz 20°C

X10-4

10

4

4

2.5

500°C

X10-4

---

30--40

30--40

---

10GHz 20°C

X10-4

---

10

10

6

Bulk resistance

100°C

Ω.cm

1012

1013

1013

1013

300°C

Ω.cm

---

1010

1010

1010

500°C

Ω.cm

---

108

108

109

Thermal shock resistance

 

 

---

pass

pass

pass

Breakdown strength

 

KV/mm

20

18

15

15

Chemical stability

1:9HCI

mg/cm2

---

7.0

7.0

0.7

10%NaOH

mg/cm2

---

0.2

0.2

0.1

Average grain size

 

μm

---

15--30

---

---

Usage

 

 

As high mechanical strength parts

As shell of pipe or circuit board substrate

As refrigeration substrate plate

As shell of pipe or circuit board substrate

**Other specifications are available to produce as customers’requirements,and Copper/Nickel/Gold/Silver etc.metallization processing!

(20 YEARS PROFESSIONAL FOR CERAMIC PLATE SERIALS) Ceramic Alumina Substrate Plate (For HIC & DBC AINWORKABLE!)



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